Highly compressible at low pressure, T-flex 600 Series is designed to alleviate tolerance problems incurred when multichip components must be mated to a universal heat-spreading device. Ultrasoft interface pad conforms well with minimal pressure, resulting in little stress to the mating parts. From Thermagon Inc., the material has thermal conductivity of 3 W/m°C and is offered in 0.020 to 0.200" thicknesses. Gap filler can be used to dampen vibration, evenly distribute stress arising from nonuniform clamping forces, conform to uneven surfaces and fill uneven air gaps.
November/December 2000, RS# 224