A thermally conductive, dielectric polymer designed for use in electronic packaging, T-pcm 700 Series is 0.005" (0.125 mm) thick, has a thermal conductivity of 1 W/m°C and thermal resistance of 0.06°C-in2/W. It is flexible but solid at room temperature (73°F [23°C]). When heated to 122°F (50°C) and with pressures as low as 5 psi, the material from Thermagon Inc. flows to fill microscopic irregularities of the heat sink and IC package. The material is available as a 9 x 9" sheet or on a roll and can be die cut to specific configurations.
September/October 2000, RS# 235