Epoxy-Sealed Thermoelectric Cooler
December 4, 2000
Low density, syntaxic foam epoxy resin provides electronic encapsulation and moisture protection on thermoelectric coolers from Melcor Corp. When cured, the material is unicellular, resulting in negligible moisture absorption. It exhibits a low dielectric constant, low coefficient of thermal expansion, minimal cure shrinkage and reduced thermal conductance.
September/October 2000, RS# 211