Alunit can be used to provide heat dissipation for high-power electronic components. The aluminum nitride ceramic substrate offers a thermal expansion coefficient that is comparable to silicon. With its insulating properties and high thermal conductivity rating (~180 W/mK), the substrate offers more insulating power and heat conductivity than conventional aluminum oxide. It is suitable for compact, high-density components and hybrids in such applications as power electronics and cooling devices. The substrate is nontoxic and environmentally compatible.
CeramTec North America
Aluminum Nitride Ceramic Substrate
May 1, 2005