Offering thermal conductivity up to 6.5W/m•K, the RoHS-controlled thermal gel can be used used to fill gaps around heat sources such as high-performance semiconductors. Other applications involve surface, underside and lead heat sources such as ICs. Series V30Z63MDP is supplied in a syringe to ease application of the gel.

Advanced Antivibration Components (AAC), (516) 328-3662

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