Soft-Paste Thermal Gel
May 6, 2010
Offering thermal conductivity up to 6.5W/m•K, the RoHS-controlled thermal gel can be used used to fill gaps around heat sources such as high-performance semiconductors. Other applications involve surface, underside and lead heat sources such as ICs. Series V30Z63MDP is supplied in a syringe to ease application of the gel.
Advanced Antivibration Components (AAC), (516) 328-3662