High Performance Power Electronics Cooler
Electronics cooler is capable of passively transferring more than 11 kW of waste heat without power, noise or moving parts. The coolers utilize thermosiphon technology, which can move large amounts of waste heat efficiently. Cooler offers an alternative to thermal packaging strategies in medium-voltage drives where waste heat is transferred from a cold plate, densely populated with power electronics modules, to a remotely located air-cooled radiator for dissipation. Existing solutions achieve this by utilizing a number of heat pipes embedded in the cold plate, which has limitations on the amount of energy that can be efficiently absorbed. According to the manufacturer, the thermosiphon technology passively removes two to three times more waste heat while maintaining the same package size. The coolers are offered with or without quick disconnects for ease of installation/removal.
Advanced Cooling Technologies (ACT) Inc.