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Home » Materials Help Achieve Smaller, Thinner, Lighter and Faster
More than 200 years after the dawn of the Industrial Revolution, innovation continues to drive manufacturing gains. One area rich with developments is heat-dissipating materials. In our increasingly computerized world, having materials that can effectively dissipate heat allows smaller, thinner, faster and lighter devices. Researchers at two universities are at work developing materials that can help.
At the University of Michigan, an engineering team developed a method to make a polymer about six times better at dissipating heat than the same material in its untreated state. The method involves dissolving the polymer in water and adding electrolytes to raise the pH, making the solution alkaline. The monomers in the polymer chain take on a negative charge and are repelled from one another. As they spread apart, say the researchers, the polymer chain’s tight coils unfurl. The polymer and water solution then is spin casted into a solid plastic sheets.