Embedded computing systems are rapidly increasing in power densities, making thermal solutions a major design concern. In most cases, designers prefer a predominantly conduction cooled approach. ICE-Lok is designed to enhance card-to-chassis, through-the-wedgelock heat conduction by adding more contact surfaces between the card and the chassis. This has enabled reduction of component temperatures of up to 18°F (10°C) in some 100 W card applications.  The wedgelocks have been tested for thermal and mechanical stability with repeated insertion/removal testing. They are designed to meet the dimensional requirements of the VITA specification. A friction-lock feature ensures that card deformation is avoided.

Advanced Cooling Technologies