On a busy day not long ago in an Atlanta food processing plant, workers bustled, producing breaded products like onion rings and fish sticks. Excitement was in the air. Unfortunately, flour dust was also in the air. While workers found ways to deal with it on their clothes, the equipment was another story.

Check out this special page to find products perfectly suited to help you and your process equipment handle high ambient temperature and humidity. As we head into the critical summer cooling season, be sure you know about products that can help solve cooling challenges.

A roundup of heavy-duty industrial fans to provide air cooling in applications from chemical processing to enclosure cooling.

One characteristic common to many electric utility companies is the mix of sizes and technologies at the utility’s various plants. This means efforts to improve performance and reduce costs can vary from plant to plant. 

In 2021, Process Cooling — with our sister publication, Process Heating — will play host to the inaugural Process Heating & Cooling Show, the only tradeshow to focus specifically on industrial applications. 

The AEC High Efficiency Central Chillers are remarkably energy efficient and can save processors up to 60% in electrical costs. The system continuously measures ambient and process conditions and will adjust to operate in the most efficient manner. 

Designed for indoor, outdoor, remote and washdown applications that require a closed-loop system to protect electronics, PKS Series can be used to cool sealed enclosures and is suited for cooling industrial electrical components that need dust protection.

Designed for toolless installation and quick filter replacement, Hoffman Type 12 HF Filter Fan incorporates time-saving features. Offered in a range of sizes, the filter fan line has a click-fit design to provide quick installation into the enclosure wall. 

With our Process Cooling 2019 index, you can revisit articles from this past year at a glance as we head into 2020.

Embedded computing systems are rapidly increasing in power densities, making thermal solutions a major design concern. In most cases, designers prefer a predominantly conduction cooled approach.